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    Field Application Engineer 5 - Seocho-gu, 대한민국. - Teradyne

    Teradyne
    Teradyne Seocho-gu, 대한민국.

    6일 전

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    설명

    Organization & Role

    If you thrive on solving challenges and love learning about the latest innovative technologies, Teradyne is the place for you. We are the test experts behind many of today's electronics products – smartphones, tablets, gaming systems, automotive electronics, computers and more. Teradyne is looking for a Field Product Specialist who will work with a cross functional team and develop strategic relationships with our customer's key technical decision makers.

    This role supports the semiconductor test division and their customers.

    Responsibilities

  • Provide expert advice to customers, Sales, FAE's and support staff while working closely with sales/marketing management and product software/hardware staff to ensure that relevant technical information is promptly and accurately communicated.
  • Develop a relationship with customers (as defined in the account plan; focus on technical/operation decision-makers).
  • Work with the sales team for selling and supporting Teradyne products (ATE=Automatic Test Equipment) from a technical point of view to achieve company DI (Design In) goals.
  • Demonstrate competitive differentiation of Teradyne products/solutions against the competition.
  • Provide technical consultations and solutions for the customer to evaluate and test the devices.
  • Identify and align Teradyne products/solution with the customer's device test requirements/roadmap.
  • Investigate trends and requirements for ATE in High Power Computing and RF device market in Japan and feedback to the marketing/engineering division.
  • Technical sales of Production Board Test products.
  • Basic Qualifications & Skills

  • ATE experience on Teradyne, such as UltraFLEX, Flex, J750, Magnum or other semiconductor ATE platforms.
  • General understanding of ATE industry trends as well as competitive products and product positioning will be a plus.
  • Willingness for international travel up to 25%.
  • Technical lead experience for more than 5 years.
  • Either High Power Computing or RF test experience for more than 2 years.
  • Knowledge in product development process.
  • Understanding of analog components and analog circuit analysis.
  • Preferably experienced in on-board-programming, Boundary Scan and Functional Test.
  • Experience in computer programming (ANSI, C, C++, C#, etc.).
  • Education

  • BSEE, BSCS or equivalent work experience.
  • Degree in Electronics Engineering.
  • #L1-SJ1



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